| NIC Print, CD,
and Downloadable Catalogs & Company Profile |
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| NIC Promotional Flyers & Placemats |
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One Sided
NIC Components Market Update
Summer
2010 Update link
8.5" x 11" (May 2010)
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Two Sided
NIC Components Product Update
May
2010 Update link
8.5" x 11" (May 2010)
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Surface Mount Aluminum Electrolytic Placemats
March 2010 Update link
8.5" x 11" - Preferred Series on Front, Full Cross Guide on Back
Click to request copy
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Leaded Aluminum Electrolytic Placemats
March 2010 Update link
8.5" x 11" - Preferred Series on Front, Full Cross Guide on Back
Click to request copy
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Surface Mount Magnetics Placemats
March 2010 Update link
8.5" x 11" -Full Magnetics Offering on Front, Full Cross Guide on Back
Click to request copy
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Surface Mount Chip (MLCC & Resistors) Placemats
March 2010 Update link
8.5" x 11" - Ceramic Offerings on Front, Resistor Offerings on Back
Click to request copy
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| NIC Product Profiles & Spotlights |
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NIC "Product Spotlight"
Focus Products - Application Solutions
 version
8-pages 8.5" x 11" letter |
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| NIC Product Profiles - |
| Series/Type |
Image |
Description |
QuickKIT |
| NSPE-x |
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Five series of Hybrid Construction Low ESR SMT Aluminum Electrolytic Capacitors |
Yes |
| +260C Reflow |
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Alum E-Cap (SMT V-Chip) 7 New High Reflow Series |
Yes |
| NAZK, NAZT, NSPE-x, NPC |
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Low ESR Aluminum E-Caps |
Yes |
| NMC High CV |
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>1uF in X7R, X5R, and Y5V Ceramic Chip Capacitors (MLCC) |
Yes |
| NPIM_C Series |
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Metal Composite High Current Power Inductors |
- |
| NPI-NPIS |
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Surface Mount Power Inductors |
- |
| NCST |
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Current Sensing Chip Resistors |
Yes |
| NPX |
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X2 Safety-Interference Suppression Film Capacitors |
Yes |
| NFCC, NFHC, NFSC |
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UL Certified Thick Film Chip Fuses |
Yes |
| NXED & NVT |
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Chip Varistors |
Yes |
| NMC X8S |
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+150C Rated "X8S" Ceramic Chip Capacitors (MLCC) |
- |
| NMC 01005 Sizes |
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01005 Case Size Ceramic Chip Capacitors (MLCC) |
- |
| NACNW |
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+105C Rated Bipolar Alum E-Cap V-chip |
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| NRSZC |
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Radial Leaded Low ESR Alum E-Cap |
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| NSMX |
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PPS Film Capacitors |
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| NTL |
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Thin Film Chip Inductors |
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| NCC |
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Surface Mount USB Common Mode Chokes |
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| NFA |
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Thick Film Chip Attenuators |
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| NTR |
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High Precision Thin Film Chip Resistors |
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| NIC Published Articles & White Papers |
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RoHS
makes impact on circuit design
Mark Osborne, NIC Components Europe
Monday 2 April 2007
PDF Version: LINK |
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INDUCTORS FEATURE :: October
2006
Trends Place Focus Upon Inductive Solutions
Sept / Oct 2006 Passive Components Industry Magazine
PDF
Version: LINK |
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WHITE
PAPER:
:: SMT PCB PROCESS FEATURE ::
Pb-Free Soldering
Robustness of Surface Mount Aluminum
Electrolytic Capacitors When Subjected to Pb-Free Reflow (soldering)
White Paper
[7pgs - 108K]
by CALCE, NIC Components
& DFR Solutions
This PAPER presented - published - featured:
IPC/JEDEC Conference April
2005
CARTS Europe;
October 2005
Nov/Dec 2005 Issue: Passive Components Magazine
Green Supply Line Green library
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WHITE
PAPER:
:: TECHNOLOGY FEATURE ::
White Paper
[10 pgs - 451K]
Hybrid Electrolyte Aluminum E-Caps feature
low ESR and stability over temperature
Features:
+ Lower ESR & Reduced Ripple Voltage
+ Improved performance over temperature
+ Reduces number of components required
+ Less PC Board Space used & Lower costs |
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