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NIC ITEM# 1284555
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NIC ITEM# 1284558
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NIC ITEM# 1284557
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NIC ITEM# 1268646
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version
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NIC ITEM# 387440
 
NIC Promotional Flyers & Placemats
 
  One Sided NIC Components Market Update

 
Summer 2010 Update link

8.5" x 11" (May 2010)  
  Two Sided NIC Components Product Update

 
May 2010 Update link

8.5" x 11" (May 2010)  
  Surface Mount Aluminum Electrolytic Placemats

 March 2010 Update
link

8.5" x 11" - Preferred Series on Front, Full Cross Guide on Back

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  Leaded Aluminum Electrolytic Placemats

 March 2010 Update
link

8.5" x 11" - Preferred Series on Front, Full Cross Guide on Back

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  Surface Mount Magnetics Placemats

 March 2010 Update
link

8.5" x 11" -Full Magnetics Offering on Front, Full Cross Guide on Back

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  Surface Mount Chip (MLCC & Resistors) Placemats

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8.5" x 11" - Ceramic Offerings on Front, Resistor Offerings on Back

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NIC Product Profiles & Spotlights
 
  NIC "Product Spotlight"
 
Focus Products - Application Solutions

version


8-pages 8.5" x 11" letter
 
NIC Product Profiles -
Series/Type Image Description QuickKIT
NSPE-x Five series of  Hybrid Construction Low ESR SMT Aluminum Electrolytic Capacitors Yes
+260C Reflow  Alum E-Cap (SMT V-Chip) 7 New High Reflow Series Yes
NAZK, NAZT, NSPE-x, NPC Low ESR Aluminum E-Caps Yes
NMC High CV >1uF in X7R, X5R, and Y5V Ceramic Chip Capacitors (MLCC) Yes
NPIM_C Series Metal Composite High Current Power Inductors -
NPI-NPIS Surface Mount Power Inductors -
NCST Current Sensing Chip Resistors Yes
NPX X2 Safety-Interference Suppression Film Capacitors Yes
NFCC, NFHC, NFSC UL Certified Thick Film Chip Fuses Yes
NXED & NVT Chip Varistors Yes
NMC X8S +150C Rated "X8S" Ceramic Chip Capacitors (MLCC) -
NMC 01005 Sizes 01005 Case Size Ceramic Chip Capacitors (MLCC) -
NACNW +105C Rated Bipolar Alum E-Cap V-chip -
NRSZC Radial Leaded Low ESR Alum E-Cap -
NSMX PPS Film Capacitors -
NTL Thin Film Chip Inductors -
NCC Surface Mount USB Common Mode Chokes -
NFA Thick Film Chip Attenuators -
NTR High Precision Thin Film Chip Resistors -
 
 
NIC Published Articles & White Papers
 
 

RoHS makes impact on circuit design
Mark Osborne, NIC Components Europe
Monday 2 April 2007

PDF Version: LINK
  INDUCTORS FEATURE ::  October 2006

Trends Place Focus Upon Inductive Solutions

Sept / Oct 2006 Passive Components Industry Magazine

PDF Version: LINK
  WHITE PAPER:
:: SMT PCB PROCESS FEATURE ::

Pb-Free Soldering
Robustness of Surface Mount Aluminum Electrolytic Capacitors When Subjected to Pb-Free Reflow
(soldering)

White Paper 
[7pgs - 108K]


by CALCE, NIC Components
& DFR Solutions

This PAPER presented - published - featured:
  • IPC/JEDEC Conference April 2005
  • CARTS Europe; October 2005
  • Nov/Dec 2005 Issue: Passive Components Magazine
  • Green Supply Line Green library
  •   WHITE PAPER:
    :: TECHNOLOGY FEATURE ::

    White Paper 
    [10 pgs - 451K]


    Hybrid Electrolyte Aluminum E-Caps feature low ESR and stability over temperature  


    Features:
    + Lower ESR & Reduced Ripple Voltage  
    + Improved performance over temperature
    + Reduces number of components required 
    + Less PC Board Space used & Lower costs 
     

    All information contained within this web site is believed to be accurate and reliable, and is presented without guarantee, 
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